ASROCK Rack SP2C741D16-2T
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ASROCK Rack SP2C741D16-2T
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Prosessorsokkel
LGA 4677 (Socket E)
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Chipset
Intel C741
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M.2 Slot
1
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Minnespor
16 x DIMM, DDR5
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Maksimal RAM-frekvens
5.6GHz
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Støttet maksimalt minne
1.5TB
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Formfaktor
EEB
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SP2C741D16-2T
Features:
- TGPIO supporting precise time synchronization between devices
- EEB (12.12'' x 13.3")
- Supports 5th and 4th Gen Intel® Xeon® Scalable Processors
- 8+8 DIMM slots (1DPC), supports DDR5 RDIMM/ RDIMM-3DS
- 5 PCIe5.0 / CXL1.1 x16
- 1 PCIe5.0 x8
- 2 MCIO (PCIE5.0 x8)
- 3 OCuLink (PCIe3.0 x4 or 4 SATA 6Gb/s)
- Supports 1 M.2 (PCIe5.0 x4)
- Up to 13 SATA 6Gb/s
- 2 RJ45 (10GbE) by Intel X710-AT2
- Remote management (IPMI)
Specifications:
Physical Status
- Form Factor EEB
- Dimensions 12.12'' x 13.3" (307 x 337.82 mm)
Processor System
- CPU Supports 5th and 4th Gen Intel® Xeon® Scalable Processors
- Socket 1+1 Socket E (LGA 4677)
- Thermal Design Power 350W
- Chipset Intel® C741
System Memory
- Supported DIMM Quantity 8+8 DIMM slots (1DPC)
- Supported Type 288-pin DDR5 RDIMM/ RDIMM-3DS
- Max. Capacity per DIMM
- RDIMM: 96GB
- RDIMM-3DS: 2H- 128 GB / 4H- 256 GB
- Max. DIMM Frequency
- 5600 MT/s on 5th Gen Intel® Xeon® Scalable Processors
- 4800 MT/s on 4th Gen Intel® Xeon® Scalable Processors
- Voltage 1.1V
PCIe Expansion Slots (SLOT7 close to CPU)
- PCIe x 16
- SLOT6: PCIe5.0 / CXL1.1 x16 [CPU0]
- SLOT5: PCIe5.0 / CXL1.1 x16 [CPU1]
- SLOT4: PCIe5.0 / CXL1.1 x16 [CPU0]
- SLOT3: PCIe5.0 / CXL1.1 x16 [CPU1]
- SLOT1: PCIe5.0 / CXL1.1 x16 [CPU1]
- PCIe x 8 SLOT2: PCIe5.0 x8 [CPU0]
Other PCIe Expansion Connectors
- M.2 slot 1 M-key (PCIe5.0 x4); support 22110/2280 form factor [CPU0]
- Others 2 MCIO (PCIE5.0 x8) [CPU0]
- OCuLink 3 OCuLink (PCIe3.0 x4 or 4 SATA 6Gb/s) [PCH]
SATA/SAS Storage
- PCH Built-in Storage Intel® C741 (Up to 13 SATA 6Gb/s, support RAID 0/1/5/10): 3 OCuLink for 12 SATA, 1 SATA 7-pin
Ethernet
- Additional GbE Controller 2 RJ45 (10GbE) by Intel® X710-AT2
Server Management
- BMC Controller ASPEED AST2600: IPMI2.0 with iKVM and vMedia support
- IPMI Dedicated GLAN 1 Realtek RTL8211F for dedicated management GLAN
Graphics
- Controller ASPEED AST2600: 1 DB15 (VGA), 1 header
Rear I/O
- UID Button/LED 1 UID button w/ LED
- Video Port 1 DB15 (VGA)
- USB 2.0 Port 2 Type-A (UBS2.0)
- RJ45 2 RJ45 (10GbE), 1 dedicated IPMI
Internal Connector/Headers
- Power Connector 1 (24-pin, ATX main power), 2 ( 8-pin, ATX 12V)
- Other Power Connectors 2 (8-pin, add-on card power & FAN)
- Auxiliary Panel Header 1 (18-pin): chassis intrusion, system fault LED, LAN1/LAN2 activity LED, locate, SMBus
- System Panel 1 (9-pin): power switch, reset switch, system power LED, HDD activity LED
- COM Header 1 (9-pin)
- VGA header 1 (15-pin)
- Fan Header 8 (6-pin)
- TPM Header 1 (13-pin, SPI)
- VROC header 1
- SGPIO Header 2
- HSBP 2
- SMBus header 2
- PMBus header 1
- IPMB Header 1
- Clear CMOS 1 (contact pads)
- Others 2 (1-pin, TGPIO header)
- USB 3.2 (Gen1) Header 1 header (19-pin, 2 USB3.2 Gen1)
- NMI Header 1
LED Indicators
- Standby PWR LED 1
- 80 Debug Port LED 1
- Fan Fail LED 8
- BMC heartbeat LED 1
System BIOS
- BIOS Type AMI UEFI BIOS; 512Mb SPI Flash ROM
- BIOS Features Plug and Play (PnP), ACPI 4.0 and above compliance wake up events, SMBIOS 3.4 and above, ASRock Rack instant flash
Hardware Monitor
- Temperature CPU, PCH, MB, Card side Temperature Sensing
- Fan
- Fan Tachometer
- CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjust by CPU Temperature)
- Fan Multi-Speed Control
- Voltage PSU +12V & +5VSB & +3.3V, +3VSB, PVNN_PCH, P1V05_PCH_STBY, P1V8_PCH_STBY, +BAT, PVCCIN_CPU0, PVCCIN_CPU1, PVCCINFAON_CPU0, PVCCINFAON_CPU1, PVCCFA_EHV_FIVRA_CPU0, PVCCFA_EHV_FIVRA_CPU1, PVCCD_HV_CPU0, PVCCD_HV_CPU1
Supported OS
- Microsoft® Windows® Server 2022 (64 bit)
- Linux
- Red Hat Enterprise Linux Server 8.4 ( 64 bit) / 8.5 ( 64 bit)
- SUSE Enterprise Linux Server 15 SP3 ( 64 bit)
- Ubuntu 21.10 (64 bit) / 22.04.2 ( 64 bit)
- Hypervisor: VMWare® ESXi 7.0 U3g / 8.0
Environment
- Temperature Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
- Humidity Non operation humidity: 20% ~ 90% ( Non condensing)
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